Invention Grant
- Patent Title: Apparatus and method with enhancement of sound quality
- Patent Title (中): 具有提高音质的装置和方法
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Application No.: US13856640Application Date: 2013-04-04
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Publication No.: US09596542B2Publication Date: 2017-03-14
- Inventor: Kang Eun Lee , Do Hyung Kim , Shi Hwa Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2012-0039223 20120416
- Main IPC: H04R3/04
- IPC: H04R3/04
Abstract:
An audio processing apparatus and method are provided. The audio processing apparatus includes an envelope detector to detect an envelope of an input signal with respect to a low frequency band, and a signal restorer to restore the input signal including a high frequency band by performing frequency folding of frequency sub-band according the envelope.
Public/Granted literature
- US20130272529A1 APPARATUS AND METHOD WITH ENHANCEMENT OF SOUND QUALITY Public/Granted day:2013-10-17
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