Invention Grant
US09596748B2 Lens mount with conductive glue pocket for grounding to a circuit board
有权
镜头安装带导电胶袋,用于接地到电路板
- Patent Title: Lens mount with conductive glue pocket for grounding to a circuit board
- Patent Title (中): 镜头安装带导电胶袋,用于接地到电路板
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Application No.: US13852373Application Date: 2013-03-28
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Publication No.: US09596748B2Publication Date: 2017-03-14
- Inventor: Wee Chin Judy Lim
- Applicant: STMicroelectronics Pte Ltd.
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K9/00

Abstract:
A lens mount is attached to a circuit board and covers electrical components on the circuit board. An electrically insulating device is positioned between the lens mount and the circuit board. The circuit board includes a grounding pad adjacent the electrically insulating device. The lens mount includes an aperture aligned with the grounding pad and the electrically insulating device. A conductive glue is dispensed into the aperture to electrically ground the lens mount to the grounding pad. The electrically insulating device seals the conductive glue from the electrical components. A method of grounding a lens mount to a circuit board is provided.
Public/Granted literature
- US20140293558A1 LENS MOUNT WITH CONDUCTIVE GLUE POCKET FOR GROUNDING TO A CIRCUIT BOARD Public/Granted day:2014-10-02
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