- 专利标题： Semiconductor manufacturing for forming bond pads and seal rings
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申请号： US14470383申请日： 2014-08-27
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公开(公告)号： US09601354B2公开(公告)日： 2017-03-21
- 发明人: Douglas M. Reber , Sergio A. Ajuria , Phuc M. Nguyen
- 申请人： Douglas M. Reber , Sergio A. Ajuria , Phuc M. Nguyen
- 申请人地址： US TX Austin
- 专利权人： NXP USA, Inc.
- 当前专利权人： NXP USA, Inc.
- 当前专利权人地址： US TX Austin
- 主分类号： H01L21/66
- IPC分类号： H01L21/66 ; H01L21/48 ; H01L23/00 ; H01L23/522 ; H01L23/58
摘要：
An integrated circuit die includes a first bond pad having a bond contact area at a first depth into a plurality of build-up layers over a semiconductor substrate of the integrated circuit die, having sidewalls that surround the bond contact area, the sidewalls extending from the first depth to a top surface of the plurality of build-up layers, and having a top portion that extends over a portion of a top surface of the plurality of build-up layers.
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