In some embodiments, a semiconductor device package may include a semiconductor device package on package assembly. The package on package assembly may include a first package, a second package, and a shield. The first package may include a first surface, a second surface substantially opposite the first surface, a first die, and a first set of electrical conductors coupled to the first surface and configured to electrically connect the package on package assembly. The second package may include a third surface and a fourth surface substantially opposite the third surface, and a second die. The third surface may be coupled to the second surface. The first package may be electrically coupled to the second package. The shield may be applied to the fourth surface of the semiconductor device package assembly. In some embodiments, the shield may transfer, during use, heat from the first die.