Invention Grant
- Patent Title: Methods of forming microstructure and electronic device having moveable component
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Application No.: US14873091Application Date: 2015-10-01
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Publication No.: US09604845B2Publication Date: 2017-03-28
- Inventor: Ming Fang
- Applicant: STMicroelectronics, Inc.
- Applicant Address: US TX Coppell
- Assignee: STMicroelectronics, Inc.
- Current Assignee: STMicroelectronics, Inc.
- Current Assignee Address: US TX Coppell
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B81C1/00 ; B81B7/00
Abstract:
A method of manufacturing microstructures, such as MEMS or NEMS devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on a portion of at least four different surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure. The process may be self-aligning.
Public/Granted literature
- US20160016792A1 MICROSTRUCTURE AND ELECTRONIC DEVICE Public/Granted day:2016-01-21
Information query
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