Invention Grant
- Patent Title: Power semiconductor module and method for cooling power semiconductor module
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Application No.: US14824871Application Date: 2015-08-12
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Publication No.: US09607924B2Publication Date: 2017-03-28
- Inventor: Daniel Kearney , Francesco Agostini , Didier Cottet , Daniele Torresin , Mathieu Habert
- Applicant: ABB Technology Oy
- Applicant Address: FI
- Assignee: ABB Technology OY
- Current Assignee: ABB Technology OY
- Current Assignee Address: FI
- Agency: Taft Stettinius & Hollister LLP
- Priority: EP14181005 20140814
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L23/473 ; H01L23/538 ; H05K1/02 ; H01L23/31 ; H05K1/18 ; H05K3/46
Abstract:
The present disclosure relates to a power semiconductor module comprising a printed circuit board (PCB), and to method of cooling such a power semiconductor module. The module comprises a power semiconductor device and an island of thermally conducting foam embedded into the printed circuit board. The power semiconductor device and the island of thermally conducting foam are positioned on top of each other, and the island is arranged to form a path for a flowing coolant cooling the power semiconductor device.
Public/Granted literature
- US20160049354A1 POWER SEMICONDUCTOR MODULE AND METHOD FOR COOLING POWER SEMICONDUCTOR MODULE Public/Granted day:2016-02-18
Information query
IPC分类:
