- 专利标题： Solid-state imaging apparatus, method of manufacturing the same, and electronic apparatus
-
申请号： US14338929申请日： 2014-07-23
-
公开(公告)号： US09608030B2公开(公告)日： 2017-03-28
- 发明人: Hiroshi Horikoshi
- 申请人： Sony Semiconductor Solutions Corporation
- 申请人地址： JP Kanagawa
- 专利权人： Sony Semiconductor Solutions Corporation
- 当前专利权人： Sony Semiconductor Solutions Corporation
- 当前专利权人地址： JP Kanagawa
- 代理机构： Sheridan Ross P.C.
- 优先权： JP2013-157934 20130730
- 主分类号： H01L27/146
- IPC分类号： H01L27/146
摘要：
A solid-state imaging apparatus includes an imaging region in which pixels are arranged, a connection region that surrounds the imaging region and includes an electrode pad, and an in-layer lens that is formed in the imaging region for each of the pixels. The in-layer lens is formed of a coating-type high-refractive-index material. The connection region includes an opening that is formed such that an upper surface of the electrode pad is exposed from the high-refractive-index material applied to the electrode pad.
公开/授权文献
信息查询
IPC分类:
