- Patent Title: Multilayer ceramic electronic component and mounting board therefor
-
Application No.: US14049139Application Date: 2013-10-08
-
Publication No.: US09613752B2Publication Date: 2017-04-04
- Inventor: Mi Young Kim , Dae Bok Oh , Jae Yeol Choi , Wi Heon Kim , Sang Huk Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Gyunggi-Do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Gyunggi-Do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0041870 20130416
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/232 ; H01G4/20 ; H01G4/012 ; H01G2/06

Abstract:
There are provided a multilayer ceramic electronic component and a mounting board therefor, the multilayer ceramic electronic component, including a ceramic body having a hexahedral shape, including dielectric layers, and satisfying T/W1.0 when a length of the ceramic body is defined as L, a width of the ceramic body is defined as W, and a thickness of the ceramic body is defined as T, and first and second internal electrodes stacked in the ceramic body to face each other, having the respective dielectric layers interposed therebetween.
Public/Granted literature
- US20140307362A1 MULTILAYER CERAMIC ELECTRONIC COMPONENT AND MOUNTING BOARD THEREFOR Public/Granted day:2014-10-16
Information query