Invention Grant
- Patent Title: Pad design for electrostatic chuck surface
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Application No.: US14550106Application Date: 2014-11-21
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Publication No.: US09613846B2Publication Date: 2017-04-04
- Inventor: Govinda Raj , Cheng-Hsiung Tsai , Robert T. Hirahara , Kadthala R. Narendrnath , Manjunatha Koppa , Ross Marshall
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: H02H7/30
- IPC: H02H7/30 ; H01L21/687 ; H01L21/683
Abstract:
Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.
Public/Granted literature
- US20150146339A1 PAD DESIGN FOR ELECTROSTATIC CHUCK SURFACE Public/Granted day:2015-05-28
Information query
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