Invention Grant
- Patent Title: Semiconductor package with double side molding
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Application No.: US15060577Application Date: 2016-03-03
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Publication No.: US09613895B1Publication Date: 2017-04-04
- Inventor: Shing-Yih Shih
- Applicant: INOTERA MEMORIES, INC.
- Applicant Address: TW Taoyuan
- Assignee: INOTERA MEMORIES, INC.
- Current Assignee: INOTERA MEMORIES, INC.
- Current Assignee Address: TW Taoyuan
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/498 ; H01L23/31 ; H01L23/00
Abstract:
A semiconductor package includes an RDL interposer having a first side, a second side, and a vertical sidewall extending between the first side and the second side; at least one semiconductor die mounted on the first side of the RDL interposer; a first molding compound disposed on the first side covering the at least one semiconductor die; a plurality of solder bumps or solder balls mounted on the second side; and a second molding compound disposed on the second side surrounding the plurality of solder bumps or solder balls and covering the vertical sidewall of the RDL interposer.
Information query
IPC分类:
