- 专利标题： Method of flip-chip assembly of two electronic components by UV annealing, and assembly obtained
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申请号： US14902426申请日： 2014-07-01
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公开(公告)号： US09613924B2公开(公告)日： 2017-04-04
- 发明人: Abdelkader Aliane , Amélie Revaux
- 申请人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 申请人地址： FR Paris
- 专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人： COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES
- 当前专利权人地址： FR Paris
- 代理机构： Norton Rose Fulbright US LLP
- 优先权： FR1356442 20130702
- 国际申请： PCT/IB2014/062767 WO 20140701
- 国际公布： WO2015/001484 WO 20150108
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L23/00 ; H01L23/498 ; H01L21/48
摘要：
The invention concerns a method of flip-chip assembly between first (1) and second (2) components each comprising connection pads (11, 21) on one of the faces of same, referred to as assembly faces, which involves transferring the components onto each other via the assembly faces of same in such a way as to create electrical interconnections between the pads of the first and second components. The invention involves transforming the copper oxide into copper by UV annealing, very locally, in the gap between the components, at least around the areas adjacent to the connection pads. The method according to the invention can be used for any component that is transparent to UV rays, including for substrates made from a plastic material such as substrates made from PEN or PET. The invention also concerns the assembly of two components obtained by the method.
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