- 专利标题： Mounting structure for circuit boards in electronic device
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申请号： US13875063申请日： 2013-05-01
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公开(公告)号： US09615467B2公开(公告)日： 2017-04-04
- 发明人: Hee-Cheul Moon , Jae-Il Seo , Hong-Moon Chun
- 申请人： Samsung Electronics Co., Ltd
- 申请人地址： KR Suwon-si, Gyeonggi-Do
- 专利权人： SAMSUNG ELECTRONICS CO., LTD
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD
- 当前专利权人地址： KR Suwon-si, Gyeonggi-Do
- 优先权： KR10-2012-0046403 20120502
- 主分类号： H04M1/00
- IPC分类号： H04M1/00 ; H05K5/00 ; H04M1/02 ; F21V33/00 ; H04M1/22 ; H04M1/23
摘要：
A mounting structure for circuit boards in an electronic device is provided. The mounting structure includes a housing, a first circuit board, a second circuit board, and an electrical connector. The housing houses parts. The first circuit board is fixed to the housing. The second circuit board is overlapped in at least a portion with the first circuit board and is fixed to the housing. The electrical connector is configured to electronically connect the first circuit board and the second circuit board.
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