Invention Grant
- Patent Title: Mounting structure for circuit boards in electronic device
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Application No.: US13875063Application Date: 2013-05-01
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Publication No.: US09615467B2Publication Date: 2017-04-04
- Inventor: Hee-Cheul Moon , Jae-Il Seo , Hong-Moon Chun
- Applicant: Samsung Electronics Co., Ltd
- Applicant Address: KR Suwon-si, Gyeonggi-Do
- Assignee: SAMSUNG ELECTRONICS CO., LTD
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD
- Current Assignee Address: KR Suwon-si, Gyeonggi-Do
- Priority: KR10-2012-0046403 20120502
- Main IPC: H04M1/00
- IPC: H04M1/00 ; H05K5/00 ; H04M1/02 ; F21V33/00 ; H04M1/22 ; H04M1/23
Abstract:
A mounting structure for circuit boards in an electronic device is provided. The mounting structure includes a housing, a first circuit board, a second circuit board, and an electrical connector. The housing houses parts. The first circuit board is fixed to the housing. The second circuit board is overlapped in at least a portion with the first circuit board and is fixed to the housing. The electrical connector is configured to electronically connect the first circuit board and the second circuit board.
Public/Granted literature
- US20130294047A1 MOUNTING STRUCTURE FOR CIRCUIT BOARDS IN ELECTRONIC DEVICE Public/Granted day:2013-11-07
Information query
