Invention Grant
- Patent Title: Thermal insulation performance measurement apparatus and measurement method using the same
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Application No.: US14058603Application Date: 2013-10-21
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Publication No.: US09618402B2Publication Date: 2017-04-11
- Inventor: Jae Sung Kwon , Hyung Sung Kim , Jong Sung Park , Young Sung Jung
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Staas & Halsey LLP
- Priority: KR10-2012-0010458 20120201; KR10-2012-0059278 20120601
- Main IPC: G01K17/00
- IPC: G01K17/00 ; F25D23/06 ; G01K17/20

Abstract:
A thermal insulation performance measurement apparatus which measures thermal insulation performance of a thermal insulator by heat flux to the thermal insulator, measured by a heat flux sensor, and a measurement method using the same includes a heat flux sensor provided with one surface adapted to contact an object to be measured, a first heat source arranged on the upper surface of the heat flux sensor to supply heat to the heat flux sensor, a thermal insulator arranged on the upper surface of the first heat source, a third heat source arranged on the upper surface of the thermal insulator, and a second heat source arranged around the heat flux sensor.
Public/Granted literature
- US20140050246A1 THERMAL INSULATION PERFORMANCE MEASUREMENT APPARATUS AND MEASUREMENT METHOD USING THE SAME Public/Granted day:2014-02-20
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