- Patent Title: Stiffener tape for electronic assembly that includes wafer or panel
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Application No.: US14963557Application Date: 2015-12-09
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Publication No.: US09620404B1Publication Date: 2017-04-11
- Inventor: Xavier F. Brun , Arjun Krishnan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H05K7/20 ; H01L21/00 ; H01L21/683 ; H01L23/373 ; H01L25/065 ; H01L23/367 ; H01L23/498 ; H01L21/48 ; H01L23/40
Abstract:
A stiffener tape for a wafer. The stiffener tape includes a mounting tape; a heat spreading stiffener removably attached to the mounting tape; and an attachment film secured to the heat spreading stiffener, wherein the attachment film includes thermal conductive fillers having at least one of silver, alumina, crystalline silica, boron nitride or aluminum nitride. An electronic assembly includes a wafer; a plurality of integrated circuits on the wafer; and an attachment film covering the plurality of integrated circuits and the substrate, wherein the attachment film includes thermal conductive fillers having at least one of silver, alumina, crystalline silica, boron nitride or aluminum nitride; and a heat spreading stiffener secured to the attachment film.
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