Invention Grant
- Patent Title: Manufacturing method for component incorporated substrate and component incorporated substrate
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Application No.: US14429741Application Date: 2012-09-26
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Publication No.: US09622352B2Publication Date: 2017-04-11
- Inventor: Ryoichi Shimizu , Mitsuo Iwamoto , Mitsuaki Toda
- Applicant: MEIKO ELECTRONICS CO., LTD.
- Applicant Address: JP Ayase-shi, Kanagawa
- Assignee: MEIKO ELECTRONICS CO., LTD.
- Current Assignee: MEIKO ELECTRONICS CO., LTD.
- Current Assignee Address: JP Ayase-shi, Kanagawa
- Agency: Marshall, Gerstein & Borun LLP
- International Application: PCT/JP2012/074711 WO 20120926
- International Announcement: WO2014/049721 WO 20140403
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H05K1/11 ; H05K1/02 ; H05K1/09

Abstract:
In a mark forming step in a manufacturing method for a component incorporated substrate in which an electronic component is positioned with reference to a mark formed in a copper layer, when an imaginary line extending from a search center of a search range of a sensor, to an edge side of the search range is represented as a search reference line and an imaginary line extending, in a state in which a mark center, is matched with the search center, from the mark center in the same direction as the search reference line to an outer ridgeline of the mark is represented as a mark reference line, the mark formed in a shape in which the outer ridgeline of the mark is present in a position where a length of the mark reference line is in a range of 30% or more of the search reference line.
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