- 专利标题: Composition for production of metal film, method for producing metal film and method for producing metal powder
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申请号: US13121005申请日: 2009-10-21
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公开(公告)号: US09624581B2公开(公告)日: 2017-04-18
- 发明人: Tetsu Yamakawa , Noriaki Oshima , Takahiro Kawabata , Tomoyuki Kinoshita , Toshio Inase
- 申请人: Tetsu Yamakawa , Noriaki Oshima , Takahiro Kawabata , Tomoyuki Kinoshita , Toshio Inase
- 申请人地址: JP Yamaguchi JP Kanagawa
- 专利权人: TOSOH CORPORATION,SAGAMI CHEMICAL RESEARCH INSTITUTE
- 当前专利权人: TOSOH CORPORATION,SAGAMI CHEMICAL RESEARCH INSTITUTE
- 当前专利权人地址: JP Yamaguchi JP Kanagawa
- 代理机构: Greenblum & Bernstein, P.L.C.
- 优先权: JP2008-272024 20081022; JP2008-272025 20081022; JP2008-272026 20081022
- 国际申请: PCT/JP2009/068136 WO 20091021
- 国际公布: WO2010/047350 WO 20100429
- 主分类号: H01B1/02
- IPC分类号: H01B1/02 ; C23C18/08 ; B22F9/24
摘要:
A composition that includes a high-valent compound of copper, silver or indium; a linear, branched or cyclic C1-18 alcohol; and a Group VIII metal catalyst forms a metal film of copper, silver or indium on a substrate when the composition is coated on the substrate and heated to reduce the high-valent compound. The composition may alternatively include metal particles of silver, copper or indium in which the surface layer of the particle includes a high-valent compound of copper, silver or indium. A metal film of copper, silver or indium may also be formed on a substrate by coating a substrate with the composition including the metal particles, and heating to reduce the high-valent compound in the same manner as above.
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