- 专利标题： Semiconductor package and method of manufacturing the same
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申请号： US14815937申请日： 2015-07-31
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公开(公告)号： US09627327B2公开(公告)日： 2017-04-18
- 发明人: Baik-woo Lee , Dong-hun Lee , Jae-gwon Jang , Chul-yong Jang
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR
- 代理机构： Renaissance IP Law Group LLP
- 优先权： KR10-2014-0134473 20141006
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L23/552 ; H01L21/56 ; H01L21/78 ; H01L23/00 ; B29C70/78 ; B29K63/00 ; B29L9/00 ; B29L31/34 ; H01L25/065 ; H01L25/18
摘要：
Provided is a method of manufacturing a semiconductor package. The method includes mounting a semiconductor device on a substrate; disposing a mold on the substrate, wherein the mold is formed to cover the semiconductor device such that at least one inner side surface of the mold has a slope; providing a molding material into the mold to encapsulate the semiconductor device; removing the mold from the substrate; and forming an electromagnetic shielding (EMS) layer to cover a top surface and side surfaces of the molding material.
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