Invention Grant
- Patent Title: Memory devices with controllers under memory packages and associated systems and methods
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Application No.: US14550243Application Date: 2014-11-21
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Publication No.: US09627367B2Publication Date: 2017-04-18
- Inventor: Seng Kim Ye , Hong Wan Ng
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Perkins Coie LLP
- Main IPC: H01L25/18
- IPC: H01L25/18 ; H01L25/065 ; H01L21/56 ; G06F13/16 ; H01L23/498 ; H01L23/31 ; H01L25/00 ; H01L23/00 ; H01L21/66
Abstract:
Memory devices with controllers under stacks of memory packages and associated systems and methods are disclosed herein. In one embodiment, a memory device is configured to couple to a host and can include a substrate, a stack of memory packages, and a controller positioned between the stack and the substrate. The controller can manage data stored by the memory packages based on commands from the host.
Public/Granted literature
- US20160148918A1 MEMORY DEVICES WITH CONTROLLERS UNDER MEMORY PACKAGES AND ASSOCIATED SYSTEMS AND METHODS Public/Granted day:2016-05-26
Information query
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