Invention Grant
- Patent Title: Electronic component
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Application No.: US14151184Application Date: 2014-01-09
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Publication No.: US09627748B2Publication Date: 2017-04-18
- Inventor: Chih-Hsien Chiu , Heng-Cheng Chu , Cheng-Yu Chiang
- Applicant: Siliconware Precision Industries Co., Ltd
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW102145090A 20131209
- Main IPC: H01Q1/38
- IPC: H01Q1/38 ; H01Q1/40 ; H01Q9/04

Abstract:
An electronic component is provided, which includes a substrate having opposite first and second surfaces and an antenna structure combined with the substrate. The antenna structure has at least a first extending portion disposed on the first surface of the substrate, at least a second extending portion disposed on the second surface of the substrate, and a plurality of connecting portions disposed in the substrate for electrically connecting the first extending portion and the second extending portion. Any adjacent ones of the connecting portions are connected through one of the first extending portion and the second extending portion. As such, the antenna structure becomes three-dimensional. The present invention does not need to provide an additional region on the substrate for disposing the antenna structure, thereby reducing the width of the substrate so as to meet the miniaturization requirement of the electronic component.
Public/Granted literature
- US20150162661A1 ELECTRONIC COMPONENT Public/Granted day:2015-06-11
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