Invention Grant
- Patent Title: Printed circuit board and electronic device
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Application No.: US14653723Application Date: 2014-10-24
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Publication No.: US09635752B2Publication Date: 2017-04-25
- Inventor: Yue Wu , Yan Ren , Zifeng Wang
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201420351013U 20140626
- International Application: PCT/CN2014/089432 WO 20141024
- International Announcement: WO2015/196673 WO 20151230
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/16

Abstract:
The present disclosure relates to the field of circuits, and provides a printed circuit board (PCB) and an electronic device. The PCB includes a substrate and a wiring layer arranged at the substrate. The wiring layer includes a digital region and an analog region, and a gap region is defined between the digital region and the analog region. The substrate is provided with a hole in the gap region, and the digital region and the analog region of the wiring layer are connected through a magnetic bead.
Public/Granted literature
- US20160270214A1 PRINTED CIRCUIT BOARD AND ELECTRONIC DEVICE Public/Granted day:2016-09-15
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