- 专利标题: Tungsten gates for non-planar transistors
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申请号: US14860336申请日: 2015-09-21
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公开(公告)号: US09637810B2公开(公告)日: 2017-05-02
- 发明人: Sameer S. Pradhan , Daniel B. Bergstrom , Jin-Sung Chun , Julia Chiu
- 申请人: INTEL CORPORATION
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Winkle, PLLC
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; C22C30/00 ; H01L29/45 ; H01L29/51 ; H01L29/49 ; H01L29/06 ; H01L21/8238 ; H01L27/092
摘要:
The present description relates to the field of fabricating microelectronic devices having non-planar transistors. Embodiments of the present description relate to the formation of gates within non-planar NMOS transistors, wherein an NMOS work-function material, such as a composition of aluminum, titanium, and carbon, may be used in conjunction with a titanium-containing gate fill barrier to facilitate the use of a tungsten-containing conductive material in the formation of a gate electrode of the non-planar NMOS transistor gate.
公开/授权文献
- US20160035724A1 TUNGSTEN GATES FOR NON-PLANAR TRANSISTORS 公开/授权日:2016-02-04
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