- 专利标题： Composite materials comprising conductive nano-fillers
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申请号： US14356653申请日： 2012-12-19
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公开(公告)号： US09640297B2公开(公告)日： 2017-05-02
- 发明人: Carmelo Luca Restuccia , Fiorenzo Lenzi , Emiliano Frulloni , Natalie Denise Jordan , Mark Edward Harriman
- 申请人： Cytec Technology Corp.
- 申请人地址： US DE Wilmington
- 专利权人： CYTEC TECHNOLOGY CORP.
- 当前专利权人： CYTEC TECHNOLOGY CORP.
- 当前专利权人地址： US DE Wilmington
- 代理商 Thi Dang
- 优先权： GB1122296.5 20111223
- 国际申请： PCT/US2012/070472 WO 20121219
- 国际公布： WO2013/141916 WO 20130926
- 主分类号： H01B1/06
- IPC分类号： H01B1/06 ; H01B1/24 ; H01B1/22 ; C08K3/04 ; C08K7/24
摘要：
A process for the production of a composition comprising one or more conductive nano-filler(s), one or more polyarylethersulphone thermoplastic polymer(s) (A), one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor, wherein said process comprises mixing or dispersing a first composition comprising one or more conductive nano-filler(s) and one or more polyarylethersulphone thermoplastic polymer(s) (A) with or into one or more uncured thermoset resin precursor(s) (P), and optionally one or more curing agent(s) therefor.
公开/授权文献
- US20140306164A1 COMPOSITE MATERIALS COMPRISING CONDUCTIVE NANO-FILLERS 公开/授权日：2014-10-16
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