Invention Grant
- Patent Title: Electronic component housing package and electronic device
-
Application No.: US14787496Application Date: 2014-09-25
-
Publication No.: US09640452B2Publication Date: 2017-05-02
- Inventor: Mahiro Tsujino , Daisuke Sakumoto
- Applicant: KYOCERA Corporation
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: KYOCERA CORPORATION
- Current Assignee: KYOCERA CORPORATION
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Volpe and Koenig, P.C.
- Priority: JP2013-198454 20130925
- International Application: PCT/JP2014/075362 WO 20140925
- International Announcement: WO2015/046292 WO 20150402
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/047 ; H01L23/057 ; H01G4/224 ; H01L23/492 ; H01L33/48 ; H01S5/022 ; H01G2/10
Abstract:
An electronic component housing package has an input/output member that is bonded to a hole part of a frame body via a brazing material. This input/output member has a top surface that is bonded to first side wall parts and a second side wall part inside the first side wall parts, and the top surface is provided with a narrow part having a narrow width at a portion that is bonded to the first side wall part. When the input/output member is bonded, the flow of the brazing material on the top surface can be controlled by the narrow part.
Public/Granted literature
- US20160104650A1 ELECTRONIC COMPONENT HOUSING PACKAGE AND ELECTRONIC DEVICE Public/Granted day:2016-04-14
Information query
IPC分类:
