Invention Grant
- Patent Title: Process for manufacturing a package for a surface-mount semiconductor device and semiconductor device
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Application No.: US14839408Application Date: 2015-08-28
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Publication No.: US09640468B2Publication Date: 2017-05-02
- Inventor: Fulvio Vittorio Fontana
- Applicant: STMicroelectronics S.r.l.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Gardere Wynne Sewell LLP
- Priority: ITTO2014A1106 20141224
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/48 ; H01L23/31
Abstract:
A surface-mount electronic device includes a body of semiconductor material, and a lead frame that includes a plurality of contact terminals. The plurality of contact terminals is electrically connected to the semiconductor body. The contact terminals are formed of sintered material.
Public/Granted literature
- US20160190046A1 PROCESS FOR MANUFACTURING A PACKAGE FOR A SURFACE-MOUNT SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE Public/Granted day:2016-06-30
Information query
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