A hermetically sealed module which comprises a central core housing including a perimeter side wall and a central core with opposed primary and secondary support surfaces. At least one coupling passageway is formed within the central core adjacent the perimeter side wall. The side wall has an sealed internal/external electrical connector which facilitates communication with the module. A multilayer substrate, with at least one flexible coupling tab, is supported by the primary support surface and at least one surface mounted component is supported by the secondary support surface. The flexible coupling tab passes through the at least one coupling passageway to facilitate coupling of a plurality of components of the multilayer substrate with a plurality of components of the at least one surface mounted component via a SMT connector. Primary and secondary lids are secured to opposed sides of the perimeter side wall and forming the hermetically sealed module.