A field device for use in an industrial process includes a housing having a cavity formed therein. A humidity-sealed electronics module has a first compartment formed therein and is positioned in the cavity. The humidity-sealed electronics module includes a seal board. The seal board separates the first compartment of the humidity sealed electronics module from a second compartment in the housing. A first electrical component in the first compartment is mounted to the seal board and a second electrical component in the second compartment is electrically connected to the first electrical component.