Invention Grant
- Patent Title: Corrosion-resistant copper bonds to aluminum
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Application No.: US15012907Application Date: 2016-02-02
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Publication No.: US09646950B2Publication Date: 2017-05-09
- Inventor: Kejun Zeng , Amit Sureshkumar Nangia
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Jacqueline J. Garner; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56
Abstract:
A method for fabricating a semiconductor device is disclosed. A packaged semiconductor device is provided having copper ball bonds attached to aluminum pads. The packaged device is treated for at least one cycle at a temperature in the range from about 250° C. to 270° C. for a period of time in the range from about 20 s to 40 s.
Public/Granted literature
- US20160181225A1 CORROSION-RESISTANT COPPER BONDS TO ALUMINUM Public/Granted day:2016-06-23
Information query
IPC分类:
