Invention Grant
- Patent Title: Manufacturing method of TFT array substrate
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Application No.: US13704156Application Date: 2012-11-14
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Publication No.: US09647013B2Publication Date: 2017-05-09
- Inventor: Xiang Liu , Jianshe Xue
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Ladas & Parry LLP
- Priority: CN201110460545 20111231
- International Application: PCT/CN2012/084598 WO 20121114
- International Announcement: WO2013/097554 WO 20130704
- Main IPC: H01L29/786
- IPC: H01L29/786 ; H01L27/12

Abstract:
Embodiments of the invention provide a manufacturing method of a TFT array substrate. The TFT array substrate is formed to comprise a plurality of scanning lines, a plurality of data lines and a plurality of pixel units defined by intersecting these scanning lines and these data lines with each other. Each of the pixel units comprises a TFT and a pixel electrode. The TFT is formed to comprise a gate electrode, a gate insulating layer, a metal oxide semiconductor layer used as an active layer, an etch stopping layer formed on a portion of the surface of the metal oxide semiconductor layer, a source electrode and a drain electrode. In this method, the metal oxide semiconductor layer, the source electrode and the drain electrode are formed by a same patterning process.
Public/Granted literature
- US20140154823A1 MANUFACTURING METHOD OF TFT ARRAY SUBSTRATE Public/Granted day:2014-06-05
Information query
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