- 专利标题： Wafer-level flip chip device packages and related methods
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申请号： US14952294申请日： 2015-11-25
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公开(公告)号： US09647188B2公开(公告)日： 2017-05-09
- 发明人: Michael A. Tischler
- 申请人： Michael A. Tischler
- 申请人地址： CA Richmond, British Columbia
- 专利权人： COOLEDGE LIGHTING INC.
- 当前专利权人： COOLEDGE LIGHTING INC.
- 当前专利权人地址： CA Richmond, British Columbia
- 代理机构： Morgan, Lewis & Bockius LLP
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L33/62 ; H01L21/78 ; H01L33/50 ; H01L23/00 ; H01L23/544 ; H01L25/065 ; H01L21/683 ; H01L33/00
摘要：
In accordance with certain embodiments, semiconductor dies are at least partially coated with a conductive adhesive prior to singulation and subsequently bonded to a substrate having electrical traces thereon.
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