Invention Grant
- Patent Title: Magnetic connection device
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Application No.: US14220757Application Date: 2014-03-20
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Publication No.: US09647385B2Publication Date: 2017-05-09
- Inventor: Hwan-soo Suh
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2013-0030986 20130322
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H01R11/30

Abstract:
A magnetic connection device including a first connector including a first housing and a plurality of first electrodes mounted on the first housing in a state of being partially exposed and having magnetic substances; and a second connector including a second housing, a plurality of second electrodes mounted on the second housing and having magnetic substances, and elastic members for elastically supporting the plurality of second electrodes, wherein an end portion of each of the plurality of second electrodes is located in the second housing due to an elasticity of the elastic members in a state where a magnetic attraction is not applied from the plurality of first electrodes, and protrudes out of the second housing to be electrically connected to each of the plurality of first electrodes when there is the magnetic attraction applied from the plurality of first electrodes.
Public/Granted literature
- US20140287601A1 MAGNETIC CONNECTION DEVICE Public/Granted day:2014-09-25
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