- 专利标题： Method for manufacturing printed circuit boards
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申请号： US13947525申请日： 2013-07-22
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公开(公告)号： US09648720B2公开(公告)日： 2017-05-09
- 发明人: Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- 申请人： Frank Ferdinandi , Rodney Edward Smith , Mark Robson Humphries
- 申请人地址： GB London
- 专利权人： Semblant Global Limited
- 当前专利权人： Semblant Global Limited
- 当前专利权人地址： GB London
- 代理机构： Baker Botts L.L.P.
- 优先权： GB0800552 20080218
- 主分类号： H05K3/28
- IPC分类号： H05K3/28 ; H05K1/02 ; H05K3/00 ; H01L23/00
摘要：
A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.
公开/授权文献
- US20130334292A1 Printed Circuit Boards 公开/授权日：2013-12-19