A device includes a substrate is substantially transparent and includes a contact surface and an interface surface. The interface surface includes a plurality of electrical contacts. The device further includes a semiconductor die, which includes a plurality of connections, a first photo detector and a second photo detector. Each of the plurality of connections includes a connection bump formed thereon to couple to the plurality of electrical contacts of the interface surface of the substrate. The plurality of connections positioned relative to the first and second photo detectors to alter a directional response of at least one photo detector of the plurality of photo detectors.