Invention Grant
- Patent Title: Pressure array sensor module and manufacturing method thereof and monitoring system and monitoring method using the same
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Application No.: US14873949Application Date: 2015-10-02
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Publication No.: US09651434B2Publication Date: 2017-05-16
- Inventor: Jui-Yiao Su , Yan-Chen Liu , Chang-Yi Chen , Ching-Shun Chen , Wen-Ching Ko
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW103134541A 20141003; TW104122718A 20150714
- Main IPC: G01D7/00
- IPC: G01D7/00 ; G01L1/20 ; A61B5/103 ; A61B5/00

Abstract:
A pressure array sensor module including an array electrode board, a plurality of pressure sensing elements, at least one first conductive structure and at least one second conductive structure is provided. The array electrode board includes a substrate and an array electrode. The array electrode, disposed on the substrate, has a first electrode pattern and a second electrode pattern. Each pressure sensing element, disposed on a sensing position of the array electrode board, includes a top electrode layer, a bottom electrode layer and at least one pressure sensing layer disposed between the top and bottom electrode layers. The top electrode layer has a first lead. The bottom electrode layer has a second lead. The first conductive structure is electrically connected between each first lead and a corresponding first electrode pattern. The second conductive structure is electrically connected between each second lead and a corresponding second electrode pattern.
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