The present disclosure is directed to an integrated multi-chip module (MCM) sensor assembly having at least one electrostatic sensor and a circuit board. The electrostatic sensor includes an outer housing with an electrode and an amplifier configured therein. The electrode includes a first end and a second end separated by a predetermined length. The second end includes a sensing face that is substantially flush with an edge of the outer housing. Further, the electrode contains a plurality of electrons configured to respond to one or more charged particles that flow past the sensing face by moving either towards or away from the second end. Thus, the amplifier is electrically coupled to the electrode so as to detect a particle level flowing past the sensing face as a function of the electron movement. Moreover, the circuit board is configured within the outer housing and is electrically coupled to the sensor.