Invention Grant
- Patent Title: Automated compute kernel fusion, resizing, and interleave
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Application No.: US14656074Application Date: 2015-03-12
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Publication No.: US09652817B2Publication Date: 2017-05-16
- Inventor: John W. Brothers , Santosh Abraham , Joohoon Lee , Abhinav Golas , Seonggun Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Lewis Roca Rothbarger Christie LLP
- Main IPC: G06K9/40
- IPC: G06K9/40 ; G06T1/20 ; G06T1/60 ; H04N5/232 ; H04N5/235 ; H04N9/04

Abstract:
In a pipelined application having different stages of processing, such as a graphics application or an image processing application, there may be a dependence of one compute kernel upon another. Data associated with individual kernels needs to be written and read. A technique to minimize a need to read and write kernel data to external memory utilize at least one of fusing kernels, resizing workgroups, and performing interleaving of kernels.
Public/Granted literature
- US20160267622A1 AUTOMATED COMPUTE KERNEL FUSION, RESIZING, AND INTERLEAVE Public/Granted day:2016-09-15
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