- 专利标题： Semiconductor device and manufacturing method thereof
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申请号： US15073219申请日： 2016-03-17
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公开(公告)号： US09653336B2公开(公告)日： 2017-05-16
- 发明人: Yi Seul Han , Jae Beum Shim , Byong Jin Kim , In Bae Park
- 申请人： Amkor Technology, Inc.
- 专利权人： Amkor Technology, Inc.
- 当前专利权人： Amkor Technology, Inc.
- 代理机构： McAndrews, Held & Malloy, Ltd.
- 优先权： KR10-2015-0037381 20150318
- 主分类号： H01L21/44
- IPC分类号： H01L21/44 ; H01L21/683 ; H01L21/768 ; H01L23/00 ; H01L21/288 ; H01L23/31
摘要：
An electronic device and a method of making an electronic device. As non-limiting examples, various aspects of this disclosure provide various methods of making electronic devices, and electronic devices made thereby, that utilize a film assist mold process.
公开/授权文献
- US20160276178A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF 公开/授权日：2016-09-22
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