Invention Grant
- Patent Title: Methods of fabricating FinFET semiconductor devices including dummy structures
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Application No.: US15167050Application Date: 2016-05-27
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Publication No.: US09653363B2Publication Date: 2017-05-16
- Inventor: Bok-Young Lee , Jeong-Yun Lee , Dong-Hyun Kim , Myeong-Cheol Kim , Dong-Woo Han
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2014-0048087 20140422
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8238 ; H01L27/088 ; H01L27/02 ; H01L21/306 ; H01L29/66

Abstract:
Provided are a semiconductor device and a method of fabricating a semiconductor device. The semiconductor device includes a first active fin and a second active fin which protrude from a substrate and extend along a first direction, a first gate structure which is on the first active fin to extend along a second direction intersecting the first direction, a second gate structure which is located adjacent to the first gate structure in the second direction and is on the second active fin to extend along the second direction, and a dummy structure which is in a space between the first gate structure and the second gate structure.
Public/Granted literature
- US20160315018A1 METHODS OF FABRICATING FINFET SEMICONDUCTOR DEVICES INCLUDING DUMMY STRUCTURES Public/Granted day:2016-10-27
Information query
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