- 专利标题： Semiconductor device
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申请号： US15184560申请日： 2016-06-16
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公开(公告)号： US09653377B2公开(公告)日： 2017-05-16
- 发明人: Shoji Yasunaga , Akihiro Koga
- 申请人： ROHM CO., LTD.
- 申请人地址： JP Kyoto
- 专利权人： ROHM CO., LTD.
- 当前专利权人： ROHM CO., LTD.
- 当前专利权人地址： JP Kyoto
- 代理机构： Hamre, Schumann, Mueller & Larson, P.C.
- 优先权： JP2013-058545 20130321; JP2013-058546 20130321; JP2013-058547 20130321; JP2013-058548 20130321; JP2013-058549 20130321; JP2014-011051 20140124
- 主分类号： H01L23/34
- IPC分类号： H01L23/34 ; H01L23/373 ; H01L23/52 ; H01L23/00 ; H01L23/433 ; H01L23/495 ; H01L23/367 ; H01L23/31
摘要：
A semiconductor device includes two or more semiconductor elements, a lead with island portions on which the semiconductor elements are mounted, a heat dissipation member for dissipating heat from the island portions, a bonding layer bonding the island portions and the heat dissipation member, and a sealing resin covering the semiconductor elements, the island portions and a part of the heat dissipation member. The bonding layer includes mutually spaced individual regions provided for the island portions, respectively.
公开/授权文献
- US20160300776A1 SEMICONDUCTOR DEVICE 公开/授权日：2016-10-13
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