Invention Grant
- Patent Title: Metal to metal bonding for stacked (3D) integrated circuits
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Application No.: US14958269Application Date: 2015-12-03
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Publication No.: US09653431B2Publication Date: 2017-05-16
- Inventor: Tien-Jen Cheng , Mukta G. Farooq , John A. Fitzsimmons
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Matthew C. Zehrer
- Main IPC: H01L25/065
- IPC: H01L25/065 ; H01L23/00 ; H01L23/488 ; H01L23/538 ; H01L25/00 ; H01L23/48
Abstract:
The present invention provides a stabilized fine textured metal microstructure that constitutes a durable activated surface usable for bonding a 3D stacked chip. A fine-grain layer that resists self anneal enables metal to metal bonding at moderate time and temperature and wider process flexibility.
Public/Granted literature
- US20160086916A1 METAL TO METAL BONDING FOR STACKED (3D) INTEGRATED CIRCUITS Public/Granted day:2016-03-24
Information query
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