Invention Grant
- Patent Title: FinFET device and method of making the same
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Application No.: US14817441Application Date: 2015-08-04
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Publication No.: US09653466B2Publication Date: 2017-05-16
- Inventor: Haining Yang , Yanxiang Liu
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L27/092 ; H01L29/06 ; H01L21/8238 ; H01L21/02 ; H01L21/265 ; H01L29/66

Abstract:
A finFET device according to some examples herein may include an active gate element above an active fin element and a dummy fin element that partially breaks the active gate element. In another example, a dummy gate element adjacent to an active gate element contains a dummy fin element that partially breaks the dummy gate element. In another example, a first dummy fin element partially breaks an active gate element and a second dummy fin element partially breaks a dummy gate element. In another example, the dummy fin element is of the same material as the active fin element. In another example, the dummy fin element partially breaks a gate element but does not extend to the substrate like the active fin element.
Public/Granted literature
- US20170040324A1 FINFET DEVICE AND METHOD OF MAKING THE SAME Public/Granted day:2017-02-09
Information query
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