- Patent Title: Composite electronic component and a board for mounting the same
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Application No.: US14315110Application Date: 2014-06-25
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Publication No.: US09654079B2Publication Date: 2017-05-16
- Inventor: Soo Hwan Son , Jin Woo Hahn , Joon Hwan Kwag , Kyoung No Lee , Myeong Gi Kim , Hwan Soo Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: McDermott Will & Emery LLP
- Priority: KR10-2013-0124710 20131018
- Main IPC: H03H7/01
- IPC: H03H7/01 ; H03H1/00

Abstract:
A composite electronic component may include: a composite body including a capacitor formed of a ceramic body in which a plurality of dielectric layers and first and second internal electrodes are laminated, and an inductor formed of a magnetic body including a coil; an input terminal disposed on a first end surface of the composite body; output terminals including a first output terminal disposed on a second end surface of the composite body and a second output terminal disposed on the second end surface of the composite body; and a ground terminal disposed on one or more of upper and lower surfaces and the first end surface of the capacitor of the composite body. The capacitor is adjacent to the inductor.
Public/Granted literature
- US20150109074A1 COMPOSITE ELECTRONIC COMPONENT AND A BOARD FOR MOUNTING THE SAME Public/Granted day:2015-04-23
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