Invention Grant
- Patent Title: Slicer apparatus and calibration method thereof
-
Application No.: US14990799Application Date: 2016-01-08
-
Publication No.: US09654315B2Publication Date: 2017-05-16
- Inventor: Yu-Chung Wei
- Applicant: VIA Technologies, Inc.
- Applicant Address: TW New Taipei
- Assignee: VIA Technologies, Inc.
- Current Assignee: VIA Technologies, Inc.
- Current Assignee Address: TW New Taipei
- Agency: Jianq Chyun IP Office
- Priority: TW104129148A 20150903
- Main IPC: H04L25/03
- IPC: H04L25/03 ; H04L25/06
Abstract:
A slicer apparatus and a calibration method thereof are provided. A differential reference signal pair used for performing an error slicing operation is adjusted, so as to calibrate an offset voltage of the slicer apparatus.
Public/Granted literature
- US20170070373A1 SLICER APPARATUS AND CALIBRATION METHOD THEREOF Public/Granted day:2017-03-09
Information query
