An electronic device includes a heat-dissipating base, a first printed wiring board assembly, and a second printed wiring board assembly. The first printed wiring board assembly is disposed on the heat-dissipating base. The first printed wiring board assembly includes a first printed wiring board and at least one first electronic component. The first electronic component is disposed on the first printed wiring board, such that the first printed wiring board assembly has a raised portion and a concave portion relative to the raised portion. The second printed wiring board assembly is at least partially disposed in the concave portion.