- Patent Title: Removal of selected portions of protective coatings from substrates
-
Application No.: US14861929Application Date: 2015-09-22
-
Publication No.: US09656350B2Publication Date: 2017-05-23
- Inventor: David J. Astle , Tyler C. Child , Vimal K. Kasagani , Cameron L. Loose , Blake L. Stevens , Max E. Sorenson
- Applicant: HzO, Inc.
- Applicant Address: US UT Draper
- Assignee: HZO, Inc.
- Current Assignee: HZO, Inc.
- Current Assignee Address: US UT Draper
- Agency: Kunzler Law Group
- Main IPC: B23K26/362
- IPC: B23K26/362 ; C23C14/04 ; C23C16/04 ; H01L21/56 ; B23K26/0622 ; B23K26/082 ; B23K26/402 ; H01L23/31 ; H05K3/28
Abstract:
A method for selectively removing portions of a protective coating from a substrate, such as an electronic device, includes removing portions of the protective coating from the substrate. The removal process may include cutting the protective coating at specific locations, then removing desired portions of the protective coating from the substrate, or it may include ablating the portions of the protective coating that are to be removed. Coating and removal systems are also disclosed.
Public/Granted literature
- US20160008923A1 REMOVAL OF SELECTED PORTIONS OF PROTECTIVE COATINGS FROM SUBSTRATES Public/Granted day:2016-01-14
Information query
IPC分类:
