Invention Grant
- Patent Title: Polyamide resin composition
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Application No.: US14797659Application Date: 2015-07-13
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Publication No.: US09657159B2Publication Date: 2017-05-23
- Inventor: Takashi Yamamoto , Jun Mitadera , Ryoji Otaki , Tomonori Kato
- Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
- Current Assignee Address: JP Tokyo
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-113028 20100517; JP2010-168081 20100727
- Main IPC: C08K5/098
- IPC: C08K5/098 ; C08L77/06 ; C08K5/101 ; C08K3/34 ; B32B1/02 ; B32B27/08 ; B32B27/34 ; C08G69/26 ; C08G69/28 ; C08J3/22 ; C08K3/32
Abstract:
The present invention relates to a polyamide resin composition comprising polyamide (X) comprising a diamine unit containing 70 mol % or more of a metaxylylenediamine unit and a dicarboxylic acid unit and an alkali compound (A), wherein the following equations (1) to (4) are satisfied: 10≦([COOH]—[NH2])≦80 (1) 0.32≦P
Public/Granted literature
- US20150315357A1 POLYAMIDE RESIN COMPOSITION Public/Granted day:2015-11-05
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