Invention Grant
- Patent Title: Brazing tape and method of forming microchannels in a thermal barrier coating
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Application No.: US15062563Application Date: 2016-03-07
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Publication No.: US09657580B1Publication Date: 2017-05-23
- Inventor: Yan Cui , Srikanth Chandrudu Kottilingam , Brian Lee Tollison
- Applicant: General Electric Company
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agent James W. Pemrick; Ernest G. Cusick; Frank A. Landgraff
- Main IPC: F01D5/18
- IPC: F01D5/18 ; B23K1/00 ; B23K35/02 ; B23K35/30 ; B23K35/32 ; B23K35/365 ; C23C14/22 ; C23C4/134 ; F01D5/28 ; F01D9/04 ; F01D25/12 ; C04B37/02

Abstract:
A method of forming micro channels in a thermal barrier coating includes placing a brazing tape on a substrate. The brazing tape has a first side and a second side with a plurality of ceramic members attached thereto. The first side is placed in contact with the substrate. A brazing step brazes the brazing tape to the substrate. An applying step applies a bond coat to the second side of the brazing tape. Another applying step applies a thermal barrier coating (TBC) onto the bond coat. A removing step removes the plurality of ceramic members by exposing the plurality of ceramic members to a ceramic solvent. A plurality of micro channels are formed in the thermal barrier coating by voids left from the plurality of ceramic members.
Information query