An electrical contact assembly for use in an integrated circuit testing apparatus having a plurality of electrical contact pins and electrical insulators that are each fashioned with through-openings that match a cross-section of a rigid shaft so that the rigid shaft can be threaded through the contact pins and insulators. This ensures that the position of each contact pin is substantially aligned in a single datum with other contact pins following the datum of the rigid shaft. The electrical insulators are placed between each contact pin to prevent electrical connection between contact pins. Further, four rigid shafts assembled in this manner may be interlocked with each other to form a rectangular assembly, which can be inserted into an appropriate housing of the testing apparatus.