Invention Grant
- Patent Title: Electronic device having a bimetallic material
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Application No.: US14124353Application Date: 2012-12-27
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Publication No.: US09658660B2Publication Date: 2017-05-23
- Inventor: Yanbing Sun , Ming Zhang
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: KED & Associates LLP
- International Application: PCT/CN2012/087631 WO 20121227
- International Announcement: WO2014/101035 WO 20140703
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G06F1/20
Abstract:
An electronic device may be provided that includes a body having one or more electronic components. The body may have a first portion and a second portion. The second portion may include a first layer of material comprising a first metal and a second layer of material comprising a second metal. At least one electronic component may be between the first portion and the second portion.
Public/Granted literature
- US20160187943A1 ELECTRONIC DEVICE HAVING A BIMETALLIC MATERIAL Public/Granted day:2016-06-30
Information query
