Invention Grant
- Patent Title: Method of forming a reduced resistance fin structure
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Application No.: US14307011Application Date: 2014-06-17
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Publication No.: US09660057B2Publication Date: 2017-05-23
- Inventor: Qing Liu , Ruilong Xie , Chun-chen Yeh , Xiuyu Cai , Kejia Wang
- Applicant: STMicroelectronics, Inc. , International Business Machines Corporation , GLOBALFOUNDRIES Inc.
- Applicant Address: US TX Coppell US NY Armonk KY Grand Cayman
- Assignee: STMicroelectronics, Inc.,International Business Machines Corporation,GLOBALFOUNDRIES Inc.
- Current Assignee: STMicroelectronics, Inc.,International Business Machines Corporation,GLOBALFOUNDRIES Inc.
- Current Assignee Address: US TX Coppell US NY Armonk KY Grand Cayman
- Agency: Seed Intellectual Property Law Group LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/78 ; H01L29/20 ; H01L29/205

Abstract:
Methods and structures for forming a reduced resistance region of a finFET are described. According to some aspects, a dummy gate and first gate spacer may be formed above a fin comprising a first semiconductor composition. At least a portion of source and drain regions of the fin may be removed, and a second semiconductor composition may be formed in the source and drain regions in contact with the first semiconductor composition. A second gate spacer may be formed covering the first gate spacer. The methods may be used to form finFETs having reduced resistance at source and drain junctions.
Public/Granted literature
- US20150364578A1 METHOD OF FORMING A REDUCED RESISTANCE FIN STRUCTURE Public/Granted day:2015-12-17
Information query
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