- 专利标题: Method of forming a reduced resistance fin structure
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申请号: US14307011申请日: 2014-06-17
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公开(公告)号: US09660057B2公开(公告)日: 2017-05-23
- 发明人: Qing Liu , Ruilong Xie , Chun-chen Yeh , Xiuyu Cai , Kejia Wang
- 申请人: STMicroelectronics, Inc. , International Business Machines Corporation , GLOBALFOUNDRIES Inc.
- 申请人地址: US TX Coppell US NY Armonk KY Grand Cayman
- 专利权人: STMicroelectronics, Inc.,International Business Machines Corporation,GLOBALFOUNDRIES Inc.
- 当前专利权人: STMicroelectronics, Inc.,International Business Machines Corporation,GLOBALFOUNDRIES Inc.
- 当前专利权人地址: US TX Coppell US NY Armonk KY Grand Cayman
- 代理机构: Seed Intellectual Property Law Group LLP
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/78 ; H01L29/20 ; H01L29/205
摘要:
Methods and structures for forming a reduced resistance region of a finFET are described. According to some aspects, a dummy gate and first gate spacer may be formed above a fin comprising a first semiconductor composition. At least a portion of source and drain regions of the fin may be removed, and a second semiconductor composition may be formed in the source and drain regions in contact with the first semiconductor composition. A second gate spacer may be formed covering the first gate spacer. The methods may be used to form finFETs having reduced resistance at source and drain junctions.
公开/授权文献
- US20150364578A1 METHOD OF FORMING A REDUCED RESISTANCE FIN STRUCTURE 公开/授权日:2015-12-17
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